LOCTITE® 3103™ is primarily designed for the purpose of bonding polycarbonate to itself without inducing stress cracking under typical molded stress levels. This adhesive cures rapidly to create flexible and transparent bonds when exposed to ultraviolet light and/or visible light with sufficient irradiance. It has demonstrated excellent adhesion to a wide range of substrates, including glass, various plastics, and most metals. Additionally, This product possesses a thixotropic nature, which helps reduce the migration of the adhesive after it is applied to the substrate. This adhesive is primarily used for bonding applications.

Supplied By: Henkel Corporation

Product Code: H01985

Regional Availability: Canada

Product Type: 1K (1 component) Adhesive, Bonding Agent

Compatible Substrates & Surfaces: Metal

Cure Method: Radiation Cure

    Enhanced TDS

    Identification & Functionality

    Features & Benefits

    Ready-to-Use Product Features
    Product Highlights
    Technology Acrylic
    Chemical Type

    Acrylated urethane

    Components

    One component - requires no mixing

    Viscosity Viscosity
    Cure

    Ultraviolet (UV)/ visible light

    Cure Benefit

    Production - high speed curing

    Application Bonding
    Flexibility

    Enhances load bearing & shock absorbing characteristics of the bond area.

    Applications & Uses

    Markets
    Applications
    Segments
    Applications
    Compatible Substrates & Surfaces
    Cure Method
    Directions for Use
    1. This product is light sensitive; exposure to daylight, UV light and artificial lighting should be kept to a minimum during storage and handling.
    2. The product should be dispensed from applicators with black feedlines.
    3. For best performance bond surfaces should be clean and free from grease.
    4. Cure rate is dependent on lamp intensity, distance from light source, depth of cure needed or bondline gap and light transmittance of the substrate through which the radiation must pass.
    5. Recommended intensity for cure in bondline situation is 5 mW/cm2 minimum (measured at the bondline) with an exposure time of 4-5 times the fixture time at the same intensity.
    6. For dry curing of exposed surfaces, higher intensity UV is required (100 mW/cm2).
    7. Cooling should be provided for temperature sensitive substrates such as thermoplastics.
    8. Plastic grades should be checked for risk of stress cracking when exposed to liquid adhesive.
    9. Excess uncured adhesive can be wiped away with organic solvent (e.g. Acetone).
    10. Bonds should be allowed to cool before subjecting to any service loads.

    Properties

    Appearance
    Transparent to slightly hazy liquid (uncured)

    Packaging & Availability

    Packaging Type
    Regional Availability
    • Canada

    Storage & Handling

    Storage

    Store product in the unopened container in a dry location.Optimal Storage: 8 °C to 21 °C. Storage below 8 °C or greater than 28 °C can adversely affect product properties. Material removed from containers may be contaminated during use. Do not return product to the original container.